Chairperson: Richard Porter
Air Force Research Laboratory (AFRL/RXME)
2977 Hobson Way
Bldg. 653, Room 215
Wright-Patterson AFB, OH  45433-7734
Phone: (937) 904-4365
Cell: (937) 479-6750
Fax: (937) 656-4420

The Electronics Processing and Fabrication Subpanel seeks abstracts on key electronics issues and solutions directly related to current defense-essential manufacturing activities.  In addition current ongoing Manufacturing Technology programs funded by DoD or its departments are encouraged to submit abstracts that show the accomplishments and the Warfighter impacts of their programs.  The combined effect of military budget constraints, rapid changes in electronics technology, and the need to deliver superior and affordable weapons to our Warfighters continues to challenge the defense manufacturing community.  Compounding the technology challenge is the requirement to sustain many of our existing weapon systems well beyond their original lifetimes.  Papers are sought that address the challenges and offer innovative manufacturing technology solutions that will keep our Warfighters second-to-none on any battlefield.  Topics of selected interest include but are not limited to:

• Lead Free Electronics
• Solder Free Assemblies (alternatives to alloy solders)
• Reliability (moisture sensitivity, fluxes, re-balling)
• Assembly and rework using Pb free solder and mixed solders
• Tin Whisker mitigation (coatings, solder dipping, platting, risk analysis)
• Nano solders or other new interconnect materials
• Identification and rework of mixed solders
• Electro-Optics Technologies
• EO Sensor and Night Vision Systems (including IRFPA)
• Optical Communications and Networking
• Analog Photonic Applications (e.g. beam forming, true time delay, antenna links)
• Laser Systems and Optics (domes, windows, lens, coatings, etc.)
• Photonics Technologies
• High Speed Optical transmissions
• Photonic Integrated Circuits (PICs)
• Photonic Interconnects for Hi-Performance Info Processing Systems
• Optical Waveguides and Nonlinear Optical Integration
• Free-space optical communications
• Photonic Imager and Display Systems
•  RF System and Component Technologies
• Innovative RF Module Manufacturing Processes, Packaging and Materials
• High Power Amplifier Manufacturing & Thermal Management
• RF Circuit Integration
• Non-Hermetic RF Module Manufacturing & Reliability
• RF System and Component Technologies
• RF System SWAP, Functionality, and Sustainability Enhancement
  Power and Energy Sources
• Production base for energy storage and generating devices and components/materials
• Advanced manufacturing initiatives for batteries and fuel cells
• Designing weapon systems for the use of batteries and fuel cells
• Disruptive energy technologies
• Making Advanced energy storage and generation devices cost effective
• Electronics Packaging & Assembly
• High Reliability Packaging and/or Automated Precision Packaging
• System On a Chip (SOC)
• Embedded Actives and Passives
• High Density Substrates and/or MEMS Packaging
• Advanced Thermal Management
• Affordable Anti-Tamper Microelectronics
• Directed Energy Technologies
• Solid State Laser (Thermal Management, High Power Laser Diodes, Adaptive Optics, Beam Control)
• High Power Microwave (Thermal Management, Low Loss Windows, Switches and Capacitors, Low Temperature + High Power Dielectrics)
• Printed Electronics and Other Innovative & Disruptive Electronics Manufacturing Technologies
• Additive Electronics Manufacturing
• Nano Electro Mechanical Systems (NEMS)
• Innovative Nano-Processing for Microelectronics
• Advanced CNT Processing for Microelectronics Devices and Thermal Management
• Graphene Carbon Technologies