Chairperson: Dr. Chris Hicks
Naval Air Systems Command
Chief Technologist (Avionics Dept 4.5)
48110 Shaw Rd., Bldg 2187, RM 2172
Patuxent River, MD 20670-1906
V: (301) 342-9094 F: (301) 342-9185
chris.hicks@navy.mil
The Electronics Processing and Fabrication Subpanel seeks abstracts on key electronics issues and solutions directly related to current defense-essential manufacturing activities. The combined effect of military budget constraints, rapid changes in electronics technology, and the need to deliver superior and affordable weapons to our warfighters continues to challenge the defense manufacturing community. Compounding the technology challenge is the requirement to sustain many of our existing weapon systems well beyond their original lifetimes. Papers are sought which address the challenges and offer innovative manufacturing technology solutions which will keep our warfighters second-to-none on any battlefield. Topics of selected interest include:
- Lead Free Electronics
- Solder Free Assemblies (alternatives to alloy solders)
- Reliability (moisture sensitivity, fluxes, re-balling)
- Assembly and rework using Pb free solder and mixed solders
- Tin Whisker mitigation (coatings, solder dipping, platting, risk analysis)
- Nano solders or other new interconnect materials
- Identification and rework of mixed solders
- Electro-Optics Technologies
- EO Sensor and Night Vision Systems (including IRFPA)
- Optical Communications and Networking
- Analog Photonic Applications (e.g. beam forming, true time delay, antenna links)
- Laser Systems and Optics (domes, windows, lens, coatings, etc.)
- RF Module Technologies
- Innovative RF Module Manufacturing Processes, Packaging and Materials
- High Power Amplifier Manufacturing & Thermal Management
- RF Circuit Integration
- Non-Hermetic RF Module Manufacturing & Reliability
- Power and Energy Sources
- Production base for energy storage and generating devices and components/materials
- Advanced manufacturing initiatives for batteries and fuel cells
- Designing weapon systems for the use of batteries and fuel cells
- Disruptive Man-portable energy technologies
- Making Advanced energy storage and generation devices cost effective
- Electronics Packaging & Assembly
- High Reliability Packaging and/or Automated Precision Packaging
- System On a Chip (SOC)
- Embedded Actives and Passives
- High Density Substrates and/or MEMS Packaging
- Advanced Thermal Management o Affordable Anti-Tamper Microelectronics
- Directed Energy Technologies
- Solid State Laser (Thermal Management, High Power Laser Diodes, Adaptive Optics, Beam Control)
- High Power Microwave (Thermal Management, Low Loss Windows, Switches and Capacitors, Low Temperature + High Power Dielectrics)
- Innovative & Disruptive Electronics Manufacturing Technologies
- Direct Write & Printed Electronics
- Additive Electronics Manufacturing
- Nano Electro Mechanical Systems (NEMS)
- Innovative Nano-Processing for Microelectronics o Advanced CNT Processing for Microelectronics Devices and Thermal Management
Selection criteria will include relevance to warfighter needs. Other topics of interest will also be considered. Selected papers may be used to introduce and support interactive panel discussions or be recommended for poster presentations. |
