Chairs: Mr. Stephen Luckowski
Chief
US Army ARDEC
Materials Manufacturing and Prototype Technology
AMSRD-AAR-MEE-M
Bldg 3150
Picatinny Arsenal, NJ 07806-5000
Email: stephen.luckowski@us.army.mil
Mr. Walter Roy
Principal
Strategic Mantech
PO Box 596
Aberdeen Proving Ground, MD 21005
410-306-0803
Email: wnroy@arl.army.mil
Presentations within the Metals track will highlight projects funded within the DOD Mantech program. Therefore priority will be given to projects that are funded by the Mantech or IBIF programs. Topics of interest to the Metals Processing and Fabrication Subpanel include:
- Technologies for processing metals and other specialty materials such as
ceramics, and metal matrix composites;
- New materials fabrication, and material by design approaches;
- Model Based Enterprise(MBE) efforts to link design, manufacturing, logistics, and the supplier network in a integrated fashion spanning the weapon system life cycle;
- Life extension of legacy weapon system parts;
- Novel fabrication and control technologies for manufacturing that lower cost and improve quality such as intelligent machining; nondestructive testing and quality assurance methods.
- Process models at the micro and macro levels that provide a reliable simulation capability in virtual space that can then be used to guide the actual factory floor fabrication process in order to reduce cost, improve the design, and increase
performance or producibility.
- Projects and initiatives that are part of the Future Vision for Fully Integrated Machining Capabilities. Of particular interest this year are:
- (a) manufacturing technology that improves system performance, reset, and or overhaul for the warfighter
- (b) process models that predict and control the properties and attributes of the final component. These models may be either at the material level or at the process level. The goal of the models is to shorten development time and achieve a quality part the first time through the process.
- (c) Novel production methods for strategic materials such as Ti, Rhenium, SiC, MMC's et al.
- (d) applications associated with MT Connect.
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