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Nov 28-Dec 1, 2016, Denver

Abstracts

2016 Abstract Submission is Closed

Abstracts (200-500 word summary) submittals will be accepted for the following topics. Topic Areas for consideration are: (ABSTRACTS MUST BE UNCLASSIFIED, PUBLIC RELEASABLE, AND NON-PROPRIETARY)

The ManTech Advanced Manufacturing Enterprise subpanel is requesting abstracts for presentations to be given at DMC 2016. Presentations should be no longer than 30 minutes including time for speaker introduction and questions. The topic for the AME sessions will be the Digital Quilt. Each session will focus on one of four topics; Design, Manufacturing, Analysis/Simulation, and the DMDII. The abstract should address the role the digital quilt takes in the topic. Abstracts that showcase successful implementations of the model based definition to improve design, manufacturing, and engineering are also welcome. Please limit the length of the abstract to 300 words.

The composites manufacturing technology session presentations are expected to be primarily sourced from invited presenters. However, the subpanel will consider outstanding technical abstracts which validate and apply advanced manufacturing technologies. You are invited to submit abstracts focused on cutting edge manufacturing advancements supporting organic matrix composite, ceramic matrix composite, carbon-carbon, as well as related processes such as polymeric additive manufacturing. Abstracts should be submitted for presentations which will share the technical details of manufacturing advancements, demonstrations, transition and transition risk reduction to products which increase in the manufacturing readiness level of enabling technologies addressing warfighter needs. Only submit abstracts where the intent is to share sufficient technical details which may provide a springboard to process improvements for the audience.

The Electronics Processing and Fabrication Subpanel requests abstracts on key electronics issues and solutions directly related to current defense-related manufacturing activities. In addition current ongoing Manufacturing Technology programs funded by DoD or its departments are encouraged to submit abstracts that show the accomplishments and the Warfighter impacts of their programs. The combined effect of military budget constraints, rapid changes in electronics technology, and the need to deliver superior and affordable weapons to our Warfighters continues to challenge the defense manufacturing community. Compounding the technology challenge is the requirement to sustain many of our existing weapon systems well beyond their original lifetimes. Papers are sought that address the challenges and offer innovative manufacturing technology solutions that will keep our Warfighters second-to-none on any battlefield. Suggested topics of selected interest include but are not limited to:

  • Lead Free Electronics
  • Solder Free Assemblies (alternatives to alloy solders)
  • Reliability (moisture sensitivity, fluxes, re-balling)
  • Assembly and rework using Pb free solder and mixed solders
  • Tin Whisker mitigation (coatings, solder dipping, platting, risk analysis)
  • Nano solders or other new interconnect materials
  • Identification and rework of mixed solders
  • Electro-Optics Technologies
  • EO Sensor and Night Vision Systems (including IRFPA)
  • Optical Communications and Networking
  • Analog Photonic Applications (e.g. beam forming, true time delay, antenna links)
  • Laser Systems and Optics (domes, windows, lens, coatings, etc.)
  • Integrated Photonics Technologies
  • High Speed Optical transmissions
  • Photonic Integrated Circuits (PICs)
  • Photonic Interconnects for Hi-Performance Info Processing Systems
  • Optical Waveguides and Nonlinear Optical Integration
  • Free-space optical communications
  • Photonic Imager and Display Systems
  • RF System and Component Technologies
  • Innovative RF Module Manufacturing Processes, Packaging and Materials
  • High Power Amplifier Manufacturing & Thermal Management
  • RF Circuit Integration
  • Non-Hermetic RF Module Manufacturing & Reliability
  • RF System and Component Technologies
  • RF System SWAP, Functionality, and Sustainability Enhancement
  • Power and Energy Sources
  • Production base for energy storage and generating devices and components/materials
  • Advanced manufacturing initiatives for batteries and fuel cells
  • Designing weapon systems for the use of batteries and fuel cells
  • Disruptive energy technologies
  • Making Advanced energy storage and generation devices cost effective
  • Electronics Packaging & Assembly
  • High Reliability Packaging and/or Automated Precision Packaging
  • System On a Chip (SOC)
  • Embedded Actives and Passives
  • High Density Substrates and/or MEMS Packaging
  • Advanced Thermal Management
  • Affordable Anti-Tamper Microelectronics
  • Directed Energy Technologies
  • Solid State Laser (Thermal Management, High Power Laser Diodes, Adaptive Optics, Beam Control)
  • High Power Microwave (Thermal Management, Low Loss Windows, Switches and Capacitors, Low Temperature +
  • High Power Dielectrics)
  • Printed Electronics and Other Innovative & Disruptive Electronics Manufacturing Technologies
  • Multi-Material Additive Manufacturing Technology
  • Additive Electronics Manufacturing
  • Nano Electro Mechanical Systems (NEMS)
  • Innovative Nano-Processing for Microelectronics
  • Advanced CNT Processing for Microelectronics Devices and Thermal Management
  • Graphene Carbon Technologies

Selection criteria will include relevance to Warfighter needs. Other topics of interest will also be considered. Selected papers may be used to introduce and support interactive panel discussions or be recommended for poster presentations.

The Co-Chairs of the 2016 DMC Energetics and Munitions Technical Track seek abstracts on energetics and munitions manufacturing technology for consideration in planning for and conducting technical sessions. Presentations should focus on the support of present and future weapon system, subsystem and component performance requirements of the warfighter and discussions on the issues and solutions impacting affordable manufacturing of superior systems and platforms. Areas to consider are affordable process technologies, controls, and analyses; new or improved manufacturing techniques/methods; environmental impacts and resolutions; technology applications and implementation; energetics and munitions life cycle issues such as demilitarization, sustainment, and repair; and the results from DOD Manufacturing Technology sponsored energetics/munitions activities. The agenda is open to industry, academia, and other government agencies, and/or teaming arrangements that include the areas of interest mentioned above, as well as other topics focusing on energetics and munitions.

Presentations within the Metals track will highlight projects that reduce cost and cycle time, improve manufacturing capability, and increase performance or producibility of metals, with special emphasis to projects funded through the DoD ManTech, RIF and IBIF programs. Topics of interest to the Metals Processing and Fabrication Subpanel include:

  1. Advanced Manufacturing Processes:
  2. a. Advanced joining technologies to include new processes, process improvements, new alloys, and dissimilar metal/material joining
    b. Advanced forming/machining technologies
    c. Additive manufacturing of metals
    d. Process models on material effects to guide the factory floor fabrication process
  3. Qualification and Certification:
  4. a. Integrated Computational Materials Engineering (ICME)
    b. Nondestructive inspection techniques for novel processes
    c. Effects of defects
    d. Rapid qualification approaches for metals processing methods and end-use parts
  5. Design/Sustainment:
  6. a. Design for manufacturability of metal components
    b. Lightweighting of system designs
    c. Life extension of legacy parts (i.e. manufacturing technology for repair, reset, and or upgrades)
    d. Reverse engineering of rare and obsolete parts
    e. Repair of high value components to extend life at reduced cost
  7. Expeditionary Manufacturing
  8. a. Manufacturing in theater or close to theater to reduce the logistics tail
    b. Manufacturing with indigenous materials

PhD Candidate Presentations

DMC will host PhD Candidate Presentations to encourage academic participating in the defense manufacturing technology arena. The Manufacturing Institutes are encouraged to contact their academic partners to identify PhD Candidates interested in presenting their research at DMC. There will be six, thirty-minute sessions available for PhD Candidates to present their material and answer questions from the audience. DMC participants, many of whom are experts in their respective fields, are available and encouraged to engage PhD Candidates on their research.

Poster Sessions

DMC will host a poster session during the conference to provide opportunities for young thinkers in the industry to showcase successes either from an academic or a professional perspective. Session participants will derive from a variety of sources:

  • Doctoral Candidates
  • Emerging Industry Professionals
  • Presenters chosen by the Chairs of Subpanel Concurrent Topics
  • Manufacturing Technology Program Managers in the Military Services and Agencies

Questions concerning Abstracts should be directed to the DMC '16 .

Critical Dates Close/Date
Abstract Submission August 1, 2016
Abstract Notification for Acceptance/Denial September 9, 2016
Presentation Due to UTC November 7, 2016

Presentation Selection

If your abstract is selected for presentation at DMC '16, you will be requested to submit presentation materials to UTC in electronic format no later than November 7, 2016. Upon acceptance of your abstract, specific instructions for technical preparation will be provided.

What is Required if Your Presentation is Selected?

  • 50-100 Word Biography Sketch of Presenter
  • Presentation for inclusion on CD Proceedings
  • Presentation for loading onto session computers
  • Each Presentation must not exceed 30 minutes (including Q&A time)
  • Presentations that are accepted must participate at the time scheduled by the Conference Committee
  • If your abstract is selected and you accept, you will be considered as an attending participant to the conference and will be required to pay the full attendee registration, as long as you are approved to attend the event by your management.
Each Technical Session Room will be equipped with the following audio-visual devices:
  • LCD Projector
  • Computer with PowerPoint installed
  • Projection Screen
  • Microphone

Questions may be directed to: